XP-G

Description

Our company offers a multi-GPU liquid cooling solution specifically designed for high-performance AI workstations. It integrates a proprietary CDM (Coolant Distribution Module) to deliver precise coolant distribution across multi-GPU parallel architectures, effectively reducing thermal buildup and enhancing overall cooling efficiency.

The system supports up to eight dual-slot GPUs operating simultaneously, and provides flexible tubing layouts and custom radiator installation options to accommodate motherboard configurations and chassis space. Radiator sizes range from  240mm to 420mm, and support high static-pressure fans with PWM control, ensuring low noise and stable temperatures even under heavy computational loads.

The cooling module offers two thermal base options:

• High-Efficiency Copper Base: CNC-machined copper with a micro-fin structure to maximize heat transfer efficiency, ideal for prolonged deep learning and model training workloads.

• VC Vapor Chamber (Vapor Chamber) Base: Provides rapid heat spreading capabilities, suitable for high-power burst scenarios such as AI inference, visual computing, or data center applications.